SISPAD 2023

The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) will be held in Kobe, Japan in 2023. According to the event organizers, the tentative dates are September 27-29. The official website for the conference is https://sispad.info.

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IEEE Open Journal of Nanotechnology

The IEEE Open Journal of Nanotechnology is one of the latest open access journals from the IEEE. https://oj-nano.ieeenano.org Their stated mission is: The IEEE Open Journal of Nanotechnology (OJ-NANO) is dedicated to publishing articles on timely topics in the field of nanotechnology by making them available immediately, freely, and permanently available to all. According to a recent email campaign, the… Continue reading IEEE Open Journal of Nanotechnology

FAKE SISPAD WARNING

Please be aware that there is a fake SISPAD conference, with multiple dates in the upcoming years. https://waset.org/simulation-of-semiconductor-processes-and-devices-conference The “World Academy of Science, Engineering and Technology” is a scam organization, which steals the names of other conferences, and holds fake conferences all of the world.  There are informative articles about this organization here: https://www.vice.com/en/article/3ky45y/hundreds-of-researchers-from-harvard-yale-and-stanford-were-published-in-fake-academic-journals https://wasetwatch.wordpress.com/… Continue reading FAKE SISPAD WARNING

Intel TCAD Position

Intel is looking for a “TCAD Software Research Engineer/Scientist“ https://jobs.intel.com/ShowJob/Id/3535370/TCAD-Software-Research-Engineer-Scientist The role involves: Creating software simulation flows, developing physical models, and analyzing the fundamental device and process issues encountered in cutting-edge technology development. Leading teams of colleagues to influence how we build software capabilities, calibrate models and process flows, perform design-technology co-optimization (DTCO), and invent… Continue reading Intel TCAD Position

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MDPI Special Issue “Device Modeling for TCAD and Circuit Simulation”

MDPI has a special issue on TCAD and circuit simulation.  Articles are published quickly after being received, and are available as open access.  Authors can submit their work until October 29, 2022. https://www.mdpi.com/journal/applsci/special_issues/circuit_simulation Some of the papers published so far seem to offer a diverse range from simulation methods to device analysis.

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On the History of the Numerical Methods Solving the Drift Diffusion Model

“On the History of the Numerical Methods Solving the Drift Diffusion Model”, by Bernd Meinerzhagen, is an excellent review article on the history of TCAD simulation methods. It discusses the importance of that Scharfetter-Gummel discretization and the use of box integration methods. https://doi.org/10.33079/jomm.20030403 In addition, it contains reference to many of the numerical methods employed… Continue reading On the History of the Numerical Methods Solving the Drift Diffusion Model

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Journal of Computational Research

The “Journal of Computational Research” from Springer is a good journal to find recent articles on TCAD simulation topics. https://www.springer.com/journal/10825 With its hybrid publication model, it is possible to find some open access articles for download concerning recent advances in device simulation.

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IEEE TED Special Issue on TCAD

The November 2021 issue of the IEEE Transactions on Electron Devices was a special issue on “New Simulation Methodologies for Next-Generation TCAD Tools”. It is available here: https://ieeexplore.ieee.org/xpl/tocresult.jsp?isnumber=9583611 It is nice to see that there is interest in ongoing research in this important aspect of semiconductor device research.

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IEEE Preprint policy

The IEEE has taken a more open view of publishing research online before final publication. This includes posting unpublished manuscripts to their officially sponsored preprint server TechRxiv. In my recent experience, they encourage uploading your preprints, as part of the IEEE journal submission process. If your article is accepted, they do ask that you place… Continue reading IEEE Preprint policy

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MOS-AK

The Modeling of Systems and Parameter Extraction Working Group (MOS-AK) is an organization holding meetings throughout the year, often colocated with other international research conferences. The topics of interest involve TCAD, compact modeling, and other EDA related areas of interest. Please visit their website at https://mos-ak.org for more information.