Sequoia Design Systems has released a new 3D Capacitance Extraction Tool for image sensors. CellCap3D is SEQUOIA’s tool for fully integrated accurate gds-to-spice calculation of capacitance matrices for image sensor cells, memory cells and similar. CellCap3D includes mesh generation, numerical solvers and graphical interfaces for viewing the 3D cell model, connected nets, capmatrix values and… Continue reading Sequoia Releases a New 3D Capacitance Extraction Tool
I have an interest in TCAD simulation. One of my projects is the development of the DEVSIM TCAD simulator. My goal with this website is to share my knowledge of this interesting discipline.
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) will be held in Kobe, Japan in 2023. According to the event organizers, the tentative dates are September 27-29. The official website for the conference is https://sispad.info.
IEEE Open Journal of Nanotechnology
The IEEE Open Journal of Nanotechnology is one of the latest open access journals from the IEEE. https://oj-nano.ieeenano.org Their stated mission is: The IEEE Open Journal of Nanotechnology (OJ-NANO) is dedicated to publishing articles on timely topics in the field of nanotechnology by making them available immediately, freely, and permanently available to all. According to a recent email campaign, the… Continue reading IEEE Open Journal of Nanotechnology
FAKE SISPAD WARNING
Please be aware that there is a fake SISPAD conference, with multiple dates in the upcoming years. https://waset.org/simulation-of-semiconductor-processes-and-devices-conference The “World Academy of Science, Engineering and Technology” is a scam organization, which steals the names of other conferences, and holds fake conferences all of the world. There are informative articles about this organization here: https://www.vice.com/en/article/3ky45y/hundreds-of-researchers-from-harvard-yale-and-stanford-were-published-in-fake-academic-journals https://wasetwatch.wordpress.com/… Continue reading FAKE SISPAD WARNING
Intel TCAD Position
Intel is looking for a “TCAD Software Research Engineer/Scientist“ https://jobs.intel.com/ShowJob/Id/3535370/TCAD-Software-Research-Engineer-Scientist The role involves: Creating software simulation flows, developing physical models, and analyzing the fundamental device and process issues encountered in cutting-edge technology development. Leading teams of colleagues to influence how we build software capabilities, calibrate models and process flows, perform design-technology co-optimization (DTCO), and invent… Continue reading Intel TCAD Position
MDPI Special Issue “Device Modeling for TCAD and Circuit Simulation”
MDPI has a special issue on TCAD and circuit simulation. Articles are published quickly after being received, and are available as open access. Authors can submit their work until October 29, 2022. https://www.mdpi.com/journal/applsci/special_issues/circuit_simulation Some of the papers published so far seem to offer a diverse range from simulation methods to device analysis.
On the History of the Numerical Methods Solving the Drift Diffusion Model
“On the History of the Numerical Methods Solving the Drift Diffusion Model”, by Bernd Meinerzhagen, is an excellent review article on the history of TCAD simulation methods. It discusses the importance of that Scharfetter-Gummel discretization and the use of box integration methods. https://doi.org/10.33079/jomm.20030403 In addition, it contains reference to many of the numerical methods employed… Continue reading On the History of the Numerical Methods Solving the Drift Diffusion Model
Journal of Computational Research
The “Journal of Computational Research” from Springer is a good journal to find recent articles on TCAD simulation topics. https://www.springer.com/journal/10825 With its hybrid publication model, it is possible to find some open access articles for download concerning recent advances in device simulation.
IEEE TED Special Issue on TCAD
The November 2021 issue of the IEEE Transactions on Electron Devices was a special issue on “New Simulation Methodologies for Next-Generation TCAD Tools”. It is available here: https://ieeexplore.ieee.org/xpl/tocresult.jsp?isnumber=9583611 It is nice to see that there is interest in ongoing research in this important aspect of semiconductor device research.
IEEE Preprint policy
The IEEE has taken a more open view of publishing research online before final publication. This includes posting unpublished manuscripts to their officially sponsored preprint server TechRxiv. In my recent experience, they encourage uploading your preprints, as part of the IEEE journal submission process. If your article is accepted, they do ask that you place… Continue reading IEEE Preprint policy